Core Technology and Features
PRINCIPLE OF PROGRAMMABLE STRUCTURED GRATING PMP IMAGING TECHNOLOGY
Utilizing Phase Modulation Profilometry (PMP) technology, three-dimensional measurements of precision printed solder paste are achieved. This approach not only ensures high-speed measurements but also significantly enhances measurement accuracy.
RGB TUNE ACTIVE THREE-COLOR AND 2D LIGHT SOURCE
The RGB Tune feature of the patent employs the separate capture of red, green, and blue color images, combined with a unique color filtering algorithm. This perfectly addresses bridging misjudgment and relative reference plane uncertainty issues. It simultaneously provides 2D/3D measurement results and colored solder paste images. Coupled with the 2D illumination source, it effectively eliminates the distortion of the RGB color effect caused by the red light angle. The RGB calibration for different substrate colors significantly enhances the device\\\\\\\'s repeatability accuracy in terms of height, volume, and area.
HIGH-RESOLUTION IMAGE PROCESSING SYSTEM
Provides a variety of different detection accuracies such as 2.8μm, 4.5μm, 5μm, 7μm, 8μm, 10μm, 12μm, 15μm, 18μm, 20μm, etc. Meet customers’ requirements for product diversity and detection speed.
Z-AXIS DYNAMIC COMPENSATION+STATIC COMPENSATION THROUGH TELECENTRIC LENS
The use of high-cost telecentric lenses and special software testing algorithms solves the problems of squint and deformation of ordinary lenses, and greatly enhances detection accuracy and detection capabilities. It achieves industry-leading dynamic compensation + static compensation for FPC warpage.
HIGH-PRECISION INTEGRATED CONTROL PLATFORM
The high-strength steel integrated structure, the standard Hefu motor and the high-precision grinding-grade ball screw and guide rail ensure high-speed and smooth movement. The optional linear motor and high-precision grating ruler can perform ultra-precise and rapid measurement of 03015 component solder paste, with a repeatability accuracy of up to 1um.
MARK POINT IDENTIFICATION, BAD MARK IDENTIFICATION AND CLOSED-LOOP CONTROL
Automatically identify Mark points and bad board marks, share real-time detection data to printers and placement machines, and adjust printing and placement processes in real time.
DATA INTEGRATION FUNCTION OF SPI, PRE-REFLOW AOI AND POST-REFLOW AOI
With different pre-furnace AOI and post-furnace AOI and other testing equipment on the SMT production line, a fully closed-loop quality control system can be formed, and the data can be synchronized to quality control systems such as ERP.
MES INTELLIGENT MANUFACTURING ACCESS CAPABILITY
The multiple data format ports developed by SINICTEK can easily, quickly and accurately transmit data to the client\\\'s MES system through the SPI system.
FIVE-MINUTE PROGRAMMING AND ONE-CLICK OPERATION
By importing the GERBER module and the friendly programming interface, engineers of any level can independently program quickly and accurately. The one-click operation designed for operators also greatly reduces the training pressure.
POWERFULPROCESS ANALYSIS (SPC)
Real-time SPC information display provides users with strong quality control support. Complete and diverse SPC tools allow users to understand at a glance. And supports data output in different formats.
APPLICATION OF 3D SPI IN ULTRA-DENSE SOLDER PASTE
MiniLED and MicroLED are composed of small LED lights. The number of small LEDs on a single board can reach more than 1 million pads. The size of a single unit of MiniLED is about 100-200μm, while the size of a single unit of MicroLED can be 50μm. The following; therefore, the 3DSPI equipment used in ultra-dense products uses the highest configuration in the industry; especially the use of marble platforms, linear motors and grating rulers to ensure the movement accuracy of small-sized pads. Using the industry\\\'s leading 1.8μm resolution telecentric lens and optimizing Gerber conversion, Load Job, algorithm, data storage and query, etc., the accuracy, speed and efficiency of detection are greatly improved.
APPLICATION OF 3D SPI IN THE FIELD OF ULTRA-LARGE BOARDS
The high-quality SMT inspection requirements for ultra-large boards for automotive electronics and LED large screens cannot be met through manual inspection. The application of STEC intelligent ultra-large board machines solves the online patch inspection of 1200-2000MM ultra-large boards to achieve high efficiency and speed. , stable detection.
SMT LINE DIAGRAM
Technical Specifications
